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  • Flip chip LED

    Flip chip LED differs from traditional LED from bonding mathod, it directly attach chip on the board, bonded by soldering bumps instead of gold or silver wire. In structure, the emitting layer is upwards and under the sapphire substrate, and directly connected to the external circuit on the board. Flip chip is recommended for several advantages:

    1.     Increase the light efficiency significantly as the light generated by emitting layer goes through the sapphire substrate directly now.

    2.     Reduce the procedure and the cost significantly. Less or no gold wires are needed, thus the die bonding process is simplified.

    3.     Better heat dissipation. The heat generated by emitting layer directly passes through the board to the air, which will certainly increase the lifespan of LED. 

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